Testing and analysis of rubber-to-metal bonded parts

Usually strong rubber-to-metal bonds permit use of parts in heavy load and hostile media industrial applications. The reliability of the bonds, and the knowledge of possible sources of failure, are of high technological relevance. Analysis of the adhesive bond bond to metal interface by X-Ray Photo-Electron Spectroscopy, and by Scanning Electron Microscope can predict failure due to premature crosslinking of the adhesive. The result provide the basis for more reliable processing.