Soldering device and method of manufacture thereof

Disclosed is a soldering device provided with a soldering tip having a front end and rear end. A blind bore is formed at the rear end of the soldering tip. An accommodating recess is formed at the bottom of this bore. A heater is arranged in the bore. A temperature sensor that is positioned between the heater and the front end of the soldering tip is arranged in this accommodating recess. A pipe is arranged in the accommodating recess. The pipe holds the temperature sensor within the accommodating recess and ensures thermal conduction between the soldering tip and the temperature sensor.