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Effect of Ultrasonic Compound Cutting on the Microstructure and Properties of Formed Chip
Effect of Ultrasonic Compound Cutting on the Microstructure and Properties of Formed Chip
2021
Sun Haimeng
Feng Jiao
Ying Niu
Zhuangfei Wang
Keywords:
Chip
Microstructure
Materials science
Ultrasonic sensor
Composite material
Correction
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