Technologies for integrated mm-Wave antennas

High datarate applications are possible by exploiting the large bandwidth offered at mm-wave frequencies. Realization of antenna modules is however not trivial at these high frequencies due to the increased material losses and higher sensitivity to manufacturing tolerances. In this paper, we study the suitability of three packaging technologies (organic, LTCC and thin-film) for the integration of 60 GHz active phased array modules. Both the antenna and interconnect performance is investigated.