Acrylic ester modified epoxy resin conductive chip adhesive

The invention relates to an acrylic ester modified epoxy resin conductive chip adhesive and belongs to the technical field of adhesives applied to microelectronic packaging. The conductive chip adhesive consists of sheet-like silver powder, epoxy resin, acrylic ester modified epoxy resin, a curing agent, a coupling agent and a diluent, wherein the acrylic ester modified epoxy resin is a copolymerization product of glycidyl methacrylate and 2 to 3 types of acrylic ester monomers and/or olefin monomers; the coupling agent comprises a silane coupling agent KH-550 and the like; and the diluent is 1,4-butanediol diglycidyl ether. The acrylic ester modified epoxy resin conductive chip adhesive has the effects that the high temperature resistance, high humidity resistance and ageing resistance of the epoxy resin are improved; the volume resistivity is low; the bonding strength is high; the conductive chip adhesive is adapted to the electronic packaging requirement of lead-free, high-temperature and high-humidity environments; the packaging reliability is improved; and the service life of packaged devices is prolonged.