Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries

With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn2O3 abrasives potential to replace disappearing CeO2 for the polishing of glass substrates.