The effect of dressing parameters on the chip loading and ground surface quality by using grinding pins and grinding wheels with very fine grits

Dressing as an integrated part of the grinding process influences the quality of ground surface and the loading of the grinding tool. This paper addresses the effect of dressing parameters, including the different dressing overlapping ratios (severely high values) and dressing speed ratios (up and down dressing modes) on the chip loading and surface finish in the grinding with micro-pins and grinding wheels with very fine grits. The results revealed that both the ground surface quality and chip loading are significantly influenced by the grinding tool topography which is generated by the dressing process. The very high dressing overlapping ratios generated a fine topography on the grinding tool, which resulted in lower chip loading and finer surface finish. Moreover, both chip nests and welded clogging on the grinding grains were observed. More welded clogging of the grinding pin was detected when the dressing overlapping ratio decreased and down dressing mode was applied. Mirror surface quality (Ra=0.035) was achieved with utilizing overlapping ratios up to 60 for a grinding wheel with grits size #500.