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Simulation of Thin Metal Film Bonding for MEMS Applications Inside a Microwave Cavity
Simulation of Thin Metal Film Bonding for MEMS Applications Inside a Microwave Cavity
2002
Jason Clendenin
Steve Tung
N. Budraa
John D. Mai
Keywords:
Mathematical optimization
Mathematics
Microwave cavity
Microelectromechanical systems
Metal
Electronic engineering
Optoelectronics
Mathematical analysis
thin metal
Correction
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