Operating limits for RF power amplifiers at high junction temperatures

Abstract LDMOS RF––power amplifier components usually operate under severe conditions challenging long-term reliability. These components are subjected to high power dissipation and consequently high junction temperatures. Failure mechanisms are highly temperature dependent and driven by coupled electro-thermo-mechanical fields as a function of stress time. In this work we have investigated the reliability of such a component. Power cycling was used to assess its reliability by introduction of temperature gradients and transient at elevated junction temperatures. The experimental lifetime acceleration conditions provided transient thermal constraints to the thermo-mechanical strength of the silicon die. Power dissipation has been adjusted to cover a broad temperature range ( T j max : 200–300 °C) in the peak of a single power cycle. Different failure modes have been observed and related to the different temperature ranges. The experimental results have been combined with thermo-mechanical FE-simulations in ANSYS, leading to the validation of simulation models and implementation in a larger simulation network. The power cycling approach as applied in this paper provided a useful addition to the steady state reliability information. In this way, clear information about margins for safe operation under dynamical conditions has been obtained. This information is needed to fully exploit the functional capability of the component and avoid over-specification in the final application. Overall, the LDMOS RF–PA component showed excellent reliability which makes it suitable for application in telecom devices.