A process for producing an electronic component having two radiation components

A method for manufacturing an electronic component, comprising: Disposing a heating element (201) between first and second radiating elements (202, 203) via a connecting member (205); Placing a gauge (206) in a space defined between the first and second radiation components, and Pressurizing the first and second radiation components from the outside, to connect the first and second radiation components and the heating element on the connecting member with each other, the jig contacts the first and second radiation components, and is the study for setting a distance between the first and second radiation components, and the teaching has a thermal expansion coefficient which is larger than that of the first and second radiation components.