Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids

We present finite element method (FEM) simulations of a thermal flow sensor as well as a comparison to measurement results. The thermal sensor is purely based on printed circuit board (PCB) technology, designed for heating, ventilation, and air conditioning (HVAC) systems. Design and readout method of the sensor enables the possibility to measure the flow velocity in various fluids. 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulations enable a fast and easy way to evaluate the sensor’s behaviour in different fluids. The results of the FEM simulations are compared to measurements in a real environment, proving the credibility of the model.