Cryogenic adhesive testing for the NIRCam optical bench assembly
2009
The Near Infrared Camera (NIRCam) Optical Bench Assembly (OBA) is a I-220H beryllium adhesively-bonded
structure designed to operate at 35K. To support design activities, an adhesive testing program was performed, with
particular emphasis on adhesive allowables at 35K. The geometries of the samples were designed to emulate the
structural features of the OBA. The testing program is described, test data presented, and the results applied to the NIRCam OBA.
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