Enhancement of Thermal Performance of Microchannels Using Different Channel Wall Geometries: A Review

The current cooling demand and the size of the microchannel sink make it very much challenging for the removal of heat in modern electronics compact components. The heat sinks with simple smooth microchannels are not adequate to remove the required heat nowadays. Uses of rib, cavity, dimple, protrusions on channel wall are the techniques to improve the Nusselt number (Nu), thermal resistance which signify better performance of the heat sink. A significant number of works on single-layered microchannel heat sink are carried out and after the proposal of new concept of double-layered heat sink for the purpose of cooling of the electronic devices, works on this type of sink are also started due to its high prospect. Silicon and water as the substrate material and coolant, respectively, are the choices of most of the researchers due to the merits they have. The present work is a review of the available literatures and research papers relevant to microchannels having different geometry structures with the objective to find and analyze the effects of the channel geometry on the enhancement of performance of microchannels.