Temperature and Dielectric Surface Roughness dependent Performance Analysis of Cu-Graphene Hybrid Interconnects
2020
To exploit the superior performance of copper and graphene interconnects, hybrid interconnects are seen as a promising interconnect technology for future technology nodes. Dielectric surface roughness is a process induced phenomenon that affects the performance of the interconnects. This paper presents an in-depth investigation on the impact of temperature and dielectric surface roughness on performance parameters of Cu-Graphene hybrid interconnects.
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