Temperature and Dielectric Surface Roughness dependent Performance Analysis of Cu-Graphene Hybrid Interconnects

2020 
To exploit the superior performance of copper and graphene interconnects, hybrid interconnects are seen as a promising interconnect technology for future technology nodes. Dielectric surface roughness is a process induced phenomenon that affects the performance of the interconnects. This paper presents an in-depth investigation on the impact of temperature and dielectric surface roughness on performance parameters of Cu-Graphene hybrid interconnects.
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    6
    References
    2
    Citations
    NaN
    KQI
    []