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Surface Activated Bonding of SiC/Diamond for Thermal Management of High-Output Power GaN HEMTs
Surface Activated Bonding of SiC/Diamond for Thermal Management of High-Output Power GaN HEMTs
2019
Y. Minoura
Keywords:
Optoelectronics
Surface activated bonding
Materials science
Thermal management of electronic devices and systems
Diamond
Correction
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