Old Web
English
Sign In
Acemap
>
Paper
>
Low Thermal Expansion Coefficient Electrodeposited Copper and its Contraction Phenomena with Annealing
Low Thermal Expansion Coefficient Electrodeposited Copper and its Contraction Phenomena with Annealing
2017
Dinh Van Quy
Kazuo Kondo
Keywords:
Thermal expansion
Metallurgy
Materials science
Inorganic chemistry
Copper
Annealing (metallurgy)
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]