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Innovative Packaging Solution for Power and Thermal Management of Wide-Bandgap Semiconductor Devices in Space Applications
Innovative Packaging Solution for Power and Thermal Management of Wide-Bandgap Semiconductor Devices in Space Applications
2006
J Barcena
C. Merveille
J. Maudes
Miquel Vellvehi
Xavier Jordà
I. Obieta
C. Guraya
L Bilbao
C Jiménez
J. Coleto
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