Hollow TSV VS solid TSV and the effect of medium filling in the hollow TSV

This paper focuses on the effect to the transmission characteristic of the hollow TSV. Three parts will be figured out to make it around using the high frequency structure simulator: first, the variation of radius and length of the hollow portion; second, the change of the position of hollow portion; the last, the effect to the transmission performance while the hollow portion is filled with different mediums having different dielectric permittivity and different conductivity. The study showed that the hollow TSV does not cause any significant impact to the TSV's transmission characteristics in the high frequency band, but we must be very careful in the VHF band. Through this work, we hope that it can provide some reference and guide for the TSV processing technology and technological process.