Low out-gassing organic spin-on hardmask
2008
Beyond 45nm node processes, ArF hyper-NA immersion lithography systems are an inevitable choice for
obtaining smaller patterns. A hyper-NA, dual BARC system is proposed to achieve low reflectivity. However, the
ability for the resist to ask as a mask is severely challenged because of the increased film thickness associated with a dual
BARC system. In order to obtain enough etch selectivity to the substrate, multi-layer resist processes can be applied.
General multi-layer resist processes uses silicon containing an inorganic spin-on hard mask and an organic spin-on hard
mask with a high carbon content. One of the problems of organic spin-on hard masks is high out-gassing, which can
cause defect issues in mass production. We have developed a new organic hard mask with low out-gassing, good
reflectivity control (< 0.2%) and good etch durability. Gap-filling performance also can be controlled by changing its
fluidity and wettability on the substrate.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
1
Citations
NaN
KQI