Electronic component, production method therefor, and sealing material paste used therein

The invention relates to an electronic component, production method therefor, and sealing material paste used therein. The electronic component has an organic member (3) between two transparent substrates (1, 2). The outer peripheral sections of the two transparent substrates (1, 2) are bonded using a sealing material (5) that comprises low-melting-point glass. The low-melting-point glass comprises vanadium oxide (V2O5), tellurium oxide (TeO2), phosphorus oxide (P2O5), and iron oxide (Fe2O3), and in terms of oxide content, corresponds to the following: V2O5+TeO2+P2O5+Fe2O3>=75 mass%, and V2O5>TeO2>P2O5>Fe2O3 (in mass%).