Fabrication of lead-free low melting temperature TeO2-V2O5-CuO glasses and wetting behavior on AlN ceramic substrate

Abstract The fabrication of novel TeO2-V2O5-CuO ternary glasses has been investigated. The structural role of V2O5 on thermal properties of glass has been explored through Fourier transformed infrared spectra and X-ray diffraction methods. Glass transition temperatures and softening temperatures of as fabricated TeO2-V2O5-CuO ternary glasses were determined by differential scanning calorimeter, reaching minimum value of 296 ℃ and 310 ℃ under the corresponding chemical composition with 15 mol% V2O5. As the V2O5/CuO content ratio decreased, thermal expansion coefficient increased from 9.85 × 10−6 K−1 to 10.9 × 10−6 K−1. The valence states of elements have been determined by X-ray Photoelectron Spectroscopy. The practical sealing property of the glasses was characterized by the contact angles on AlN substrates, which declined drastically from 124° to 34° under temperature of 510℃ by increasing CuO concentration. The structural and thermal properties as well as wetting behavior make this TeO2-V2O5-CuO ternary glasses a potential candidate to be applied in electronics package.