Glass woven fabric and multilayer printed circuit board

PURPOSE:To provide a multilayer printed circuit board having excellent dimensional stability by laminating glass woven fabrics having a warp density, a weft density and a fiber count in a specific relation range to each other and subsequently curing the laminated product. CONSTITUTION:Glass woven fabric having a cloth thickness of 40-70mum and a warp density [(y) warps/25mm], a weft density [(x) wefts/25mm] and a fiber count (ztex) in a relation satisfied with an inequality 65 =200, x=0.757y+ or -8 and z=1193/(x+y)+ or -1 is formed. The glass woven fabric is impregnated with a thermosetting resin such as an epoxy resin, polyimide resin or bismaleimide resin, and the formed prepregs are laminated to each other and cured.