Flip-chip GaAs MMICs for microwave MCM-D applications

High speed data communications systems increasingly require the use of advanced techniques to reduce size and cost and improve performance. GaAs MMIC technologies for wireless transceiver modules are required to perform low noise and power amplification, switching, mixing and LO functions. The capability of providing passive filtering in MCM-D substrate technology makes this an attractive interconnection medium, and the integration of flip-chip mounted GaAs MMICs can provide a cost-effective solution in module manufacture. Characterisation of the impact of flip-chip mounted GaAs MMIC structures within an MCM-D environment is presented, with a discussion of the relative merits of partitioning system elements between MCM-D and GaAs components. Results from a complete transceiver MMIC function at 5.2 GHz assembled using the GaAs/MCM-D techniques are described, with comparisons made to results achieved using conventional assembly methods.