A 220GHz High-Efficiency Wideband Fully-Integrated Chip-to-Chip Interconnect with Flat Loss in Band

A novel wideband THz chip-to-chip interconnect is presented in this work. The THz link is composed of fully integrated on-chip CPW based couplers and a low-cost planar dielectric waveguide. This structure is based on a slow wave leaky CPW, which does not require mode converter or balun in addition. The cross-sectional width of the coupler structure is tapered in the direction of wave propagation to increase the coupling efficiency and maintain a large coupling bandwidth while minimizing its on-die size. A rectangular dielectric waveguide, constructed from high resistance silicon material, is co-designed with the on-chip coupler structure to minimize coupling loss. The coupling structure achieves a minimum insertion loss of 4.2 dB from 206 to 238 GHz and a flat performance in band (10% 1dB bandwidth), with end-to-end link simulation presented. This system provides a packaging-friendly, cost effective, and high-performance planar integration solution for wideband THz chip-to-chip communication.