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Investigation on the release of residual stress in a folded structure applied to MEMS devices
Investigation on the release of residual stress in a folded structure applied to MEMS devices
2021
Tang Chuying
Hongyu Yu
Chengliang Sun
Yi Zhang
Liang Wang
Cai Yao
Jingyi Wu
Wang Qing
Sheng Liu
Keywords:
Microelectromechanical systems
Folded structure
Composite material
Residual stress
Materials science
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