Old Web
English
Sign In
Acemap
>
Paper
>
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability
2022
Donghua Li
Defu Sun
Xiumei Bi
Guiqing Liu
Yingxin Zhang
Yuqi Cui
Yingxin Song
Zongtao Chi
Zhongsen Sun
Chuanzhong Chen
Keywords:
Chip
Reliability (statistics)
Mechanical engineering
Sintering
Materials science
Soldering
Joint (geology)
Correction
Source
Cite
Save
Machine Reading By IdeaReader
26
References
0
Citations
NaN
KQI
[]