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3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
2010
Sridhar
Vincenzi
Ruggiero
Brunschwiler
Atienza
Keywords:
Microchannel
Computer cooling
Three-dimensional integrated circuit
Integrated circuit design
Solid modeling
Transient (oscillation)
Thermal management of electronic devices and systems
Nuclear engineering
Thermal
Materials science
Correction
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