Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA Package

With increased demands on system integration, performance and low production cost, flip chip mounting of dies has become an attractive technology. Flip Chip assembly using 60/40 solder is a well established technology but due to environmental concerns non solder based solutions will very soon be required. In this work we will compare assembly using solder bumps with assembly using adhesive bumps both for the interconnection between the chip and the substrate and between the package and the board.