Old Web
English
Sign In
Acemap
>
Paper
>
Session 5 Flip chip and interconnection
Session 5 Flip chip and interconnection
2008
Hirofumi Nakajima
Tomoshi Ohde
Keywords:
Electronic engineering
Thermal copper pillar bump
Flip chip
Interconnection
Materials science
Optoelectronics
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]