Synthetic Solution of IPD Design, Packaging Method, and Reliability Test Based on GaAs-Based Fabrication Technology

Synthetic solution of integrated passive device (IPD) design, packaging method, and reliability test is presented in this study on the basis of the GaAs-based fabrication technology. Starting from the beginning of the modeling/design of equivalent circuits, until the mask array/fabrication and even final packaging/measurement, the whole process have been discussed thoroughly. Primary components, such as resistors, inductors, and capacitors, are designed and optimized with appropriate values and high Q-factor, and they are subsequently used to achieve the IPDs with compact size and excellent RF performance. SOT-6 packaging method protects the fabricated chip from physical damage and reliability test proves such an IPD synthetic solution can be a potential candidate for a commercial applicability.