Circuit device and manufacturing method

The invention provides a device, which comprises a circuit device, a cooling fin and a thermal interface material layer, wherein the thermal interface material layer is thermally coupled to the circuit device and the cooling fin; the thermal interface material layer comprises a first alloy layer, a nanometal particle layer and a second alloy layer; the first alloy layer is thermally coupled to the circuit device; the nanometal particle layer is thermally coupled to the first alloy layer; and the nanometal particle layer comprises nanometal particles and an intermediate mixture.