A high density board mounted power module for distributed powering architectures

A high-density DC/DC converter module developed to be a fundamental building block in a distributed power architecture using a 50 V backplane bus is described. A power density of 55 W/in/sup 3/ has been achieved using a high-frequency fully resonant circuit topology. The converter exhibits an overall efficiency greater than 80% with an 18 MHz nominal switching frequency. Other features of the converter are operation from -55 degrees C to 125 degrees C baseplate temperature and very low input/output ripple and EMI. >