Effects on Dielectric Properties of Modified Bismaleimide Resins

Abstract Six modified bismaleimide (BMI) resin systems are developed. The modifier is diallyl bisphenol A, diallyl bisphenol A ether. TDE-85 epoxy/MNA anhydride, and styrene. respectively. In view of structure of those cured resins, relationships between structure and dielectric properties have been studied emphatically, while effects of postcure temperature and catalysts on dielectric properties were also shown. Results indicate that dielectric properties lie on structure of cured resin and postcure temperature; catalysts can strikingly improve the heat-resistance of materials, but has little effect on the dielectric properties. In addition, mechanical and thermal properties of neat resins were also shown.