3D optical measuring and data processing applied in flexible electronics manufacturing

Flexible-electronics is gaining increasing popularity in microelectronics such as flexible display, smart skin, epidermal electronics and soft robotics due to cost-effective fabrication and possibility of obtaining multifunctional electronics over large areas. Distinct from conventional microelectronics, flexible curved substrate such as polyimide has been adopted in the flexible-electronics manufacturing process. Hence, how to measure the curved surfaces of the substrates in a precise and fast way has become a key issue. Traditionally, the curved surfaces are usually measured in a coordinate measuring machine (CMM). However, the polyimide substrates (<1mm) are so thin that they are vulnerable to be scratched and deformed. To solve the problem, this paper presents a 3D measuring system based on the laser displacement sensor, high precision motion platform and programmable multi-axis controller (PMAC). Meanwhile, to process the measured data and inspect the machining quality of the substrate by using the 3D matching methods, a software called iPoint3D was developed.