Understanding delamination for fast development of reliable packages for automotive applications. A consideration of robustness for new packages based on simulation

Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. This issue is usually addressed by exposing the component to temperature cycling stress tests for a certain number of cycles, followed by e.g. scanning acoustic microscopy (SAM) to investigate delamination. Discussions about specific cycling conditions, e.g. using −65 °C/+175 °C instead of −55 °C/+150 °C for the minimum and maximum temperatures of the cycles or even using liquid-liquid cycling instead of air to air to speed up investigations [1], are often moot, because no real understanding of the effect of the cycling conditions on the component is available.