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Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
2021
Sang Hyeok Kim
Seong-Jin Kim
Han-Kyun Shin
Hyun Park
Cheol Ho Heo
Seongjae M
Hyo-Jong Lee
Keywords:
Wetting
Materials science
Electroplating
Soldering
substrate
Composite material
Correction
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