Preparation technology of ultra thin fused silica glass sheet

The fused silica glass is needed in the electronics and micro manufacturing industry. The thickness requirement is 0.02 ~ 0.2mm, which is difficult to be achieved by traditional machining. In this paper, a new thinning technology is proposed. Through the combination of chemical mechanical polishing (CMP and chemical etching, ultra-thin fused silica glass with diameter of 50 mm, thickness of 0.05 mm and Ra＜1 nm can be prepared. It was also found that the fused silica glass could be thinned uniformly and efficiently by high-speed rotation and adding active agent in the chemical etching process.