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Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
2020
Fuya Nagano
Serena Iacovo
Alain Phommahaxay
Fumihiro Inoue
Erik Sleeckx
Stefan De Gendt
Gerald Beyer
Eric Beyne
Keywords:
Carbon nitride
Materials science
Silicon
Optoelectronics
Wafer
Direct bonding
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