Thermal characterization of SSOP packages

This paper details the use of measurement and simulation techniques to carry out thermal performance analysis of shrink small outline packages (SSOPs). The measurements were undertaken in a thermal test fixture developed by Alcatel Bell during ESPRIT Project 9197 - DELPHI. This test fixture, which consists of a double cold plate configuration, was specifically designed to facilitate validation of detailed component models. The CFD code FLOTHERM was used as the simulation tool and correlation between measured and modelled results was typically better than 7%.