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Development of a multilayer organic packaging technique for a fully embedded T/R module
Development of a multilayer organic packaging technique for a fully embedded T/R module
2011
Patterson
Thrivikraman
Bhattacharya
Coen
Cressler
Papapolymerou
Keywords:
Silicon-germanium
Noise figure
Radio frequency
development
Integrated circuit packaging
Optoelectronics
Scattering parameters
Materials science
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