A wide band absorbing structure based on milled Cu conductive film and 3D printed layer

Abstract A wide band absorbing structure was designed based on the milled flaky Cu film and 3D-printed layer. The conductive flaky Cu particles were fabricated by the mechanical milling method. The matching layer was fabricated based on the 3D printing process, and it was constructed by the bottom plate and the upper shaped plate. Using the light curing process, the conductive Cu film could be painted on the upper matching layer surface. Then the reflection loss (RL) was simulated in the CST Microwave Studio software with different structure parameters. It was found that the absorber had the wide band absorption, the RL value was less than −15dB in 6–20 GHz. The layer height, the resistant film length had an apparent influence on the absorbing property. Later, as the oblique incident microwave was set and the oblique incident angle increased to 50°, the absorbing band with RL less than −10dB was still 8–18 GHz.