Chemical and mechanical properties of UV-cured nanoimprint resists and release layer interactions
2008
UV-curable nanoimprint resist characteristics and performance are key to controlling resist-related defects formed during
template removal due to cohesive failure and strong resist-template adhesion. The debonding process is governed by
both the chemical bonds that form between the template and the resist during cure, and by the structure of the resist itself
which determines its elastic-plastic response under load. To gain insight to contributions from resist composition to the
debonding process we examine the connection between mechanical and chemical properties of a family of methacrylate
polyfunctionalized polyhedral oligomeric silsesquioxane (mPSS) containing resists to their adhesion to fluoroalkyl silane
release layers. We also survey debonding of one of the mPSS formulations, an acrylate formulation and a vinyl ether
formulation from as series of metal oxide and metal nitride release layers. The results show that while intrinsic storage
modulus of a cured material is important, interfacial segregation of reactants in fluid resists can influence adhesive
properties as well. The metal-containing release layers are shown to have generally much lower adhesion to cured resists
than does a fluoroalkyl silane release layer. They present a useful alternative for template release treatments.
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