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3-Dimensional, Solder-Free Interconnect Technology for High-Performance Power Modules
3-Dimensional, Solder-Free Interconnect Technology for High-Performance Power Modules
2012
Mouawad
Buttay
Soueidan
morel
allard
Fabregue
Bley
Keywords:
Power module
Resist
Soldering
interconnect technology
Mechanical engineering
Materials science
Correction
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