Manufacturing process for glass core substrates for integrated circuit chips

The method (300), comprising: Providing a glass body having a series of embedded conductive wires (330); and Cutting slices from the glass body (335), each disc having a first surface (412) and an opposite second surface (414) which is parallel to the first surface is substantially with a portion of each embedded wire remains in each of the disks and extending from the first surface (412) to the second surface (414) of the disc extends, each embedded wire portion provides a a corresponding row of conductors; wherein two or more slices of a glass core for a substrate to provide (345); wherein the glass body includes alignment elements (355), and wherein the method further comprises aligning the two or more slices using the alignment elements includes (345), while the two or more pulleys are connected together to provide the glass core.