Integrated Interface Circuits for Capacitive Micromechanical Sensors

Caused by rapid progress of silicon technology, electronic circuits and micromechanical sensors like accelerometers and pressure transducers can now be fabricated as microstructures [1,2,3]. Most sensors transform the external force into either a piezoelectric or a capacitive signal. For some applications, capacitive sensors are more sensitive and less temperature dependend than their piezoelectric counterparts and are therefore being preferred.