Coating process of photoresist

The invention provides a coating process of photoresist, wherein the surface of a wafer is coated with the photoresist; the wafer is arranged on a vacuum table plate of a centrifugal machine; a nozzle component is arranged above the wafer; the nozzle component comprises a solvent nozzle and a photoresist nozzle; the coating process comprises the steps of A. moving the solvent nozzle to the part above the center position of the wafer, and spraying a solvent of the photoresist onto the wafer to improve the subsequent adhesion between the photoresist and the wafer; B. driving the wafer to do high-speed revolution for the first time by the vacuum table plate to enable the whole surface of the wafer to be evenly covered with the solvent sprayed by the solvent nozzle, and moving the photoresist nozzle to the part above the center position of the wafer; C. spraying the photoresist onto the wafer by the photoresist nozzle; D. driving the wafer to do high-speed revolution for the second time by the vacuum table plate to enable the whole surface of the wafer to be evenly covered with the solvent sprayed by the solvent nozzle. After the coating process of the photoresist is used, the dosage of the photoresist is reduced, and the coating uniformity of the photoresist on the wafer is improved.