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Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damage
Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damage
2015
Floriane Leroy
Thomas Tillocher
Liping Zhang
Philippe Lefaucheux
Koichi Yatsuda
Kaoru Maekawa
Jean-Francois de Marneffe
Mikhaïl Baklanov
Remi Dussart
Keywords:
Etching
Reactive-ion etching
Plasma
Porosity
Materials science
Composite material
Correction
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