Old Web
English
Sign In
Acemap
>
Paper
>
LIFE CYCLE ASSESSMENT APPLIED TO THE PHYSICAL PROCESS TO RECOVERY COPPER FROM PRINTED CIRCUIT BOARD
LIFE CYCLE ASSESSMENT APPLIED TO THE PHYSICAL PROCESS TO RECOVERY COPPER FROM PRINTED CIRCUIT BOARD
2019
Sílvia C. Pinho
Belmira Neto
J.O. Dias
Keywords:
Automotive engineering
Engineering
Printed circuit board
Copper
Life-cycle assessment
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]