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Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections
Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections
2014
Chuanhong Fan
Osamu Asai
Ryosuke Furuya
Ken Suzuki
Hideo Miura
Keywords:
Composite material
Materials science
Crystallinity
Electroplating
Thin film
Copper
Metallurgy
copper thin film
Correction
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