A Packaged 2×2 Switch Array for Power Handling and Isolation Improvement

This paper presents a packaged 2×2 dc-contact Radio Frequency Micro-Electro-Mechanical Systems (RF MEMS) switch array. The 2×2 switch array shows higher power handling ability compared with 1×1 switch and higher isolation compared with 2×1 switch array. Packaging process was implemented in a wafer level packaging (WLP) method using adhesive benzocyclobutene (BCB) bonding. The insertion loss and isolation of packaged switch are better than -1 dB and -20 dB @ 30 GHz. And the lifetime of packaged switch is over 1 million cycles under cold-switching condition with 400 mA dc power. Furthermore, the switch could deal with a maximum power of 1.5 W @ 10 GHz for 2 hours when the switch remains hold-down condition.